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Model 7935 Wafer Inspection System
Product Details
Applied with high speed camera and inspection algorithms, the 7935 can inspect a 2" wafer in 2 minutes for specific defect items; the throughput is about 15 msec/chip. The 7935 also provides auto focus and warpage compensation function to overcome wafer warpage and chuck leveling issue. There are three magnification objective lens for selection by corresponding chip size or defect size. The minimum resolution of the system is 0.7um that has capability to detect 2 um defect. System Function After the tape expansion process , the arrangement of dies on wafer may be formed an irregular alignment. the 7935 also offers software alignment function to adjust wafer alignment angle for scan. In addition, the 7935 owns a friendly user interface to
reduce user's learning time. All of inspection information like mapping map, defect
region, inspection results is visualized for easy reading. Defect Analysis Inspection result raw datas are recorded not only pass/fail information but also bin data. This is easily to analysis an optimal parameter that achieves the balance of overkill and underkill. The data also helps to monitor the defect trend caused by the production process, and feedback to production unit in advance. In conclusion, Chroma 7935 is an ideal cost and performance selection for wafer chip inspection process. |
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