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Cobra Temperature Forcing System
For ATE Or SLT Test Applications

 

Key Features
  • Compact footprint, < 80 lbs
  • Liquid-free operation
  • Semi-automation
  • High dissipative power without LN2
  • User-friendly GUI
  • -40°C to 150°C operating temperature range
  • Cost competitive
  • Direct phase change
  • Configurable rack mounting
  • Universal Socketing Capability
  • Programmable temperature and pneumatics
  • Power monitoring to prevent thermal runaway
  • Thermal Sensing Diode feedback

Data Sheet

Targeted Applications
  • Automotive IC
  • Graphic Processors (GPU)
  • Application Processing Units (APU)
  • AI and Data Center
  • Aerospace and Defense
  • CPUs
  • ASICs
  • Memory Modules

 

Product Details
GUI Interface Experience GUI Control Center Application specific to IC-DUT Socket Force set up options

Cobra Thermal Systems are an advanced, compact, powerful temperature-forcing system and is an adaptable solution to the ever-increasing thermal demands of post-silicon validation and device characterization. With a temperature range of -40°C to 150°C, and combining all the benefits of mobility, quiet operation and liquid-free technology, it is designed primarily for SLT applications with long test times using manual device placement. The rack system layout optimizes mass parallelism that can be easily set up and customized to specific user-defined specifications. Cobra Systems are equipped for next-generation product development for high wattage temperature-controlled road map demands. Prevention of thermal runaway and limiting board or device damages are handled by a Power Monitoring unit which is sold separately as needed and currently available only for SLT solutions.

 

 

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