Our Co-Packaged Optics (CPO) Assembly Equipment enables high-precision, scalable integration for next-generation data centers, while our High-Channel-Density Optoelectronics Reliability & Burn-In System ensures the long-term performance of photonic components under real-world conditions. Designed for efficiency, scalability, and un-compromised performance, our innovations empower a seamless ramp-up in the AI Zeitgeist.

Fully automatic modules listed below operating in a synergistic  way