Photonics

Chroma's photonics test solutions address mainly on automated test equipment for laser diode, VSCEL, LED both in wafer and chip format as well as optical communication active components.

With more than 30 years of power electronic and automated optical test experience, Chroma offers many integrated mechanism and temperature control technology capable of performing reliable characteristics and aging test for optical devices under various temperature test conditions.

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Test Systems

Model 58604-C

High Channel Density Burn-In Tester Model 58604-C

Burn-In, reliability and life test
ACC and AVC modes
Independent channels for source and measurement

Model 58604

Laser Diode Burn-in and Reliability Test System

Applicable for burn-in, reliability, and life testing
AAC and APC control modes
Individual channel driving and measurement

Model 58605

High Power Laser Diode Burn-in and Reliability Test System

Burn-in, reliability, and life test
AAC and APC control modes
Independent channel for source and measurement
Spike-Free sourcing

Model 58606

Photodioe Burn-in and Reliability Test System

Burn-in, reliability, and life test
Dark Current and Breakdown Voltage
256 channels Bi-polar device source per drawer

Model 58620

Laser Diode Characterization System

Full Turn-Key Automated Test for edge and surface emitting laser diodes
High precision and large capacity carrier, interchangeable with other automated equipment

Model 58602

Optoelectronic Source Measurement System

Burn-in, Reliability, and Life Testing
Up to 6912 Channels
Up to 20A per device
Up to 150°C
CoS, C-Mount, T0, VCSEL Card, VCSEL Package, Custom

Model 58212-C

LED Mapping Probe Tester Model

High speed and accuracy
Lateral, verticle, and flip chip
Wide power test range (up to 200V/2A)
Up to 8" wafers
Chroma® Huge Photo Detector

Model 58625

Photonics Module Test System

All-in-one test system
Flexible test station arrangement
Precise temperature control -20~85°C
Large beam angle measurement
Nanosecond high-speed testing (optional)

Model 58635

Photonic Array Wafer Probing Test System

References: ISO/IEC standards
Up to 6” water
Wide range and precise temperature control

Inspection Systems

Model 7945

In-process Wafer Die Inspection System

Double-side inspection (post-diced wafer)
Full color defect detection
Selectable resolution and algorithms: VCSELs, PDs, LEDs, and Discrete Devices

Model 7940

Wafer Chip Inspection System

Simultaneous double-side color inspection
6” wafer / 8” inspection area
Automatic wafer alignment
Wafer shape / edge identification

Model 7661-K003

Mini LED Backlight Module Automatic Optical Test System

Comprehensive characterization

Chromaticity
Luminance
Uniformity
Dies defect
Voltage / Current

Model 7503

3D Optical Profiler

Up to 0.1 nm height resolution for measurement
Use white light interference measurement technique to do nondestructive and rapid surface texture measurement and analysis