Model 7940
Wafer Chip Inspection System
Key Features
- Simultaneous double side color inspection
- 6" wafer/8" inspection area
- Automatic wafer alignment
- Wafer shape/edge identification
- Unique defect detection algorithm
- Versatile defect criteria definitions
- Complete defect classification
- Defect detection rate >98%
- Wafer mapping
- Yield
- Up/down stream operation
