Chiplet Summit

The Chiplet Summit is an annual conference and trade show for the semiconductor industry, focusing entirely on chiplet technology, which are small, modular pieces of silicon that can be combined to create powerful, complex chips for AI, high-performance computing, and other applications, offering cost, performance, and time-to-market benefits over traditional single-chip designs. It brings together designers, engineers, and vendors to discuss advanced packaging, die-to-die interfaces (like UCIe), heterogeneous integration, testing, and the broader chiplet ecosystem, featuring keynotes, tutorials, and exhibits from industry leaders.